Waste Management & Recycling
L3-WMS-ELEC-PCB SUPPORTING RESOURCES Level 3 · hardware

PCB Substrate Disposal

PCB Substrate Grinding + Glass-Fiber Recovery

The PCB substrate grinding and glass-fiber recovery unit processes de-metaled FR4 epoxy-glass boards into reusable fibers and inert filler for sintered construction blocks. Built with a hardened steel grinder, sieve screens, and an Inconel char chamber, the 25 kg system operates at 200 W with a throughput of 5 kg per hour. Designed for a 15-year operational lifetime, the mechanism eliminates long-mission dead-mass storage by mechanically separating structural glass fibers, incinerating epoxy char for energy recovery, and capturing hazardous bromine flame retardants for isolated containment.

After metal recovery, PCB substrates (FR4 epoxy-glass) are ground for glass-fiber recovery or used as filler in L1-MFG sintering.

Purpose

After metal recovery, PCB substrates (FR4 epoxy-glass) are ground for glass-fiber recovery or used as filler in L1-MFG sintering.

Context

Child of L2-WMS-ELEC within the Lunar Ark system

Principles

Typical implementations

Lunar considerations

Specifications

Functional

primary functionAfter metal recovery, PCB substrates (FR4 epoxy-glass) are ground for glass-fiber recovery or used as filler in L1-MFG sintering.
throughput kg per hour5

Physical

mass kg25
materialsHardened steel grinder, Sieve screens, Inconel char chamber
vacuum compatibilityTrue

Operational

power consumption w200
thermal range c-40, 70
lifetime years15
mtbf hours20000

Interfaces

Provides

Requires

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Cite this entry

Lunar Ark Codex. "PCB Substrate Disposal" (L3-WMS-ELEC-PCB). Retrieved 10 September 2026, from https://lunarark.com/entry/L3-WMS-ELEC-PCB

Licensed CC-BY-SA 4.0. You may reuse and adapt this entry with attribution, under the same licence.

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