Active Thermal Control System
L3-TCS-INTF-GAP SUPPORTING THERMAL Level 3 · hardware

Thermal Gap Fillers

Compliant Gap-Filling Thermal Interface Pads

Thermal gap fillers are compliant elastomeric pads, typically formulated from a silicone elastomer base with aluminum oxide or boron nitride fillers, designed to bridge 0.5 mm to 5 mm clearances between equipment and thermal mounting surfaces. These interfaces accommodate manufacturing tolerances and deliver thermal conductivities of 1 to 6 W/mK under low compression forces that prevent excessive preload on sensitive components. For lunar systems, gap fillers must maintain thermal performance across the full temperature range, satisfy ASTM E595 and NASA SP-R-0022A outgassing requirements in vacuum, and resist long-term compression set that degrades contact effectiveness over decades.

Compliant pads filling variable gaps between equipment and thermal mounting surfaces

Purpose

Accommodate manufacturing tolerances while maintaining thermal contact across gaps

Context

Child of L2-TCS-INTF in the Active Thermal Control System

Principles

Typical implementations

Lunar considerations

Specifications

Functional

primary functionCompliant pads filling variable gaps between equipment and thermal mounting surfaces

Physical

materialsSilicone elastomer base, Al2O3 thermally conductive filler, Fiberglass reinforcement

Interfaces

Provides

Requires

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Lunar Ark Codex. "Thermal Gap Fillers" (L3-TCS-INTF-GAP). Retrieved 10 September 2026, from https://lunarark.com/entry/L3-TCS-INTF-GAP

Licensed CC-BY-SA 4.0. You may reuse and adapt this entry with attribution, under the same licence.

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