Passive Thermal Control
L3-PTC-STRUC-DOUBL ESSENTIAL THERMAL Level 3 · hardware

Thermal Doubler / Heat Spreader

Aluminum / Copper Thermal Doubler Heat Spreader

A thermal doubler is a 6061-T6 aluminum or copper plate bolted or epoxied to high-power electronics, such as FPGAs and MOSFETs, to conductively spread concentrated heat across a larger area for radiator or phase-change material contact. In the lunar vacuum, the absence of atmospheric convection requires all waste heat to be dispersed purely via conduction and radiation across extreme temperature swings. Operating passively with zero power consumption, a thermal conductivity of 200 W/(m·K), and a mass of 5 kg, the plate reduces localized hot spots over a 100-year operational lifetime.

Aluminum or copper thermal doubler plates spreading concentrated heat sources (FPGAs, MOSFETs) across a larger area for radiator or PCM contact.

Purpose

Aluminum or copper thermal doubler plates spreading concentrated heat sources (FPGAs, MOSFETs) across a larger area for radiator or PCM contact.

Context

Child of L2-PTC-STRUC within the Lunar Ark system

Principles

Typical implementations

Lunar considerations

Specifications

Functional

primary functionAluminum or copper thermal doubler plates spreading concentrated heat sources (FPGAs, MOSFETs) across a larger area for radiator or PCM contact.
thermal conductivity w per mk200

Physical

mass kg5
materials6061-T6 Al plate, Cu alternative for high-conductivity
vacuum compatibilityTrue

Operational

power consumption w0
thermal range c-40, 70
lifetime years100
mtbf hours1000000

Interfaces

Provides

Requires

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Cite this entry

Lunar Ark Codex. "Thermal Doubler / Heat Spreader" (L3-PTC-STRUC-DOUBL). Retrieved 10 September 2026, from https://lunarark.com/entry/L3-PTC-STRUC-DOUBL

Licensed CC-BY-SA 4.0. You may reuse and adapt this entry with attribution, under the same licence.

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